LG and SK Enmove partner on low-GWP refrigerants and immersion cooling for AI data centers
biz.chosun.comLG Electronics and SK Enmove signed an MOU to jointly develop next-generation refrigerants with a GWP below 150 and free of PFAS. They will also work on matching refrigeration oils and immersion cooling for AI data centers. The partnership targets tighter refrigerant regulations in Europe and North America, and aims to expand cooling tech to ESS and EV components. The two firms will combine SK Enmove's refrigerant expertise with LG's HVAC system experience. They have already run joint immersion cooling demos with US firm GRC. This could reduce the climate impact of cooling systems, which are a major source of emissions. The move also addresses rising energy demand from AI data centers. For readers tracking low-carbon industry, this is a concrete step toward lower-GWP refrigerants and more efficient data center cooling. Watch for commercialization timelines and whether the refrigerant actually hits the market before regulation deadlines.
