Jinglin Packaging at 2026 SMM Conductor and Cable Exhibition: Copper, Aluminum, and Grid Decarbonization
news.metal.comShanghai Jinglin Packaging will join the 2026 SMM (11th) Conductor and Cable Industry Exhibition on November 5-6, 2026. The event covers conductor and electrical materials with a focus on UHV lines, new energy, computing power centers, and NEV demand. The company will show packaging lines for copper plate, rod, coil, and busbar products. Organizers frame the conference around the dual-carbon strategy and the shift to new-type power systems. Copper and aluminum supply are tight, prices are volatile, and trade and cost pressures are rising. Aluminum substitution and copper-aluminum composites are getting more attention as a result. Anyone tracking grid buildout or clean energy supply chains can use the event as a signal for where materials demand is heading. The exhibition is scheduled for November 5-6, 2026.
