Researchers have developed a technique called Ultrafast Laser Chemical Vapor Deposition to print conductive carbon circuits directly onto glass. This method removes the need for traditional 2D lithography masks, allowing for 3D wiring on the interior and exterior surfaces of glass substrates. This breakthrough aims to improve semiconductor packaging for AI and quantum sensors. By enabling more efficient spatial wiring and better thermal properties, the technology could reduce the energy footprint and complexity of next generation high performance computing hardware.
